6 or 8 Inches Wafer Testing

Deaote's 6 or 8 inches Wafer testing is designed to meet the stringent requirements of wafer-level testing—including sub-micron positioning accuracy, stable contact force control, and compatibility with diverse wafer types—this probe station integrates advanced motion control systems, vacuum chuck technology, and anti-vibration design to deliver reliable, repeatable performance for electrical characterization, parametric testing, and reliability testing of semiconductor wafers.

Built with Deaote's decades of expertise in precision mould and motion component manufacturing, the 6 or 8 inches Wafer testing probe station features a rigid, thermally stable granite base and ultra-precise XY stage, ensuring micron-level alignment between probe cards and wafer dies. It is compatible with a wide range of probe cards (vertical, cantilever, MEMS) and testing equipment (ATE systems, parametric analyzers), making it suitable for both R&D and high-volume production testing of logic chips, memory chips, power semiconductors, and optoelectronic devices.

The modular design of the 6 or 8 inches Wafer testing probe station allows for easy customization to meet specific testing requirements, including temperature-controlled chuck options (-40℃ to 150℃) for high/low temperature testing, automated wafer handling for high-throughput production, and seamless integration with data acquisition systems. Our solution helps semiconductor manufacturers and testing labs improve testing accuracy, reduce false failure rates, and enhance overall testing efficiency.

Core Advantages

1. Sub-Micron Positioning Accuracy

Equipped with high-resolution linear encoder closed-loop feedback (0.05μm resolution) and air-bearing XY stage, the probe station achieves ±0.5μm repeat positioning accuracy and ±1μm absolute positioning accuracy for wafer alignment. This ensures precise contact between probe needles and wafer pads (contact accuracy ≤1μm), eliminating misalignment-induced test errors and ensuring reliable electrical characterization results.

2. Stable Contact Force Control

Integrated piezoelectric ceramic drive and force sensing system enable precise control of probe contact force (0.1g to 50g per needle), with uniform force distribution across the probe card. This prevents wafer pad damage (scratching, delamination) and ensures consistent electrical contact resistance, critical for low-power and high-frequency wafer testing applications.

3. Thermally Stable & Anti-Vibration Design

Constructed with a natural granite base (ultra-low thermal expansion coefficient ≤0.5×10⁻⁶/℃) and active anti-vibration system, the probe station minimizes positional drift caused by temperature fluctuations and external vibrations. The temperature-stabilized chuck (temperature stability ±0.1℃) further ensures consistent testing conditions, essential for high-precision parametric testing of semiconductors.

4. 6/8 Inch Wafer Compatibility & Flexibility

The 6 or 8 inches Wafer testing probe station supports seamless switching between 6-inch and 8-inch wafer sizes with adjustable vacuum chuck and wafer alignment guides, no need for custom fixture replacement. It is compatible with various wafer types (silicon, GaAs, SiC, GaN) and thicknesses (100μm to 775μm), adapting to diverse semiconductor testing needs (logic, memory, power devices, optoelectronics).

5. High Throughput & Easy Operation

Optimized motion control algorithms enable fast wafer stage movement (max speed 100mm/s) and quick die-to-die positioning (settling time ≤50ms), supporting high-throughput testing (up to 2000 dies per hour). The intuitive touchscreen HMI and compatible software (GPIB, USB, Ethernet interfaces) enable easy integration with ATE systems and automated testing workflows, reducing operator training time and human error.

6. Low Maintenance & Long Service Life

Air-bearing stage and non-contact drive mechanisms eliminate mechanical wear, reducing maintenance frequency and extending service life (MTBF ≥30,000 hours). The enclosed design with HEPA filtration system prevents dust contamination of wafers and probe cards, while IP54 protection grade ensures reliable operation in cleanroom environments (Class 1000/100).

Technical Specifications

Application Scenarios

Engineered exclusively for 6/8 inch wafer testing, our probe station is widely used in the following semiconductor testing applications:

● Parametric Testing: DC/AC characterization of logic chips, memory chips (DRAM, NAND), and power semiconductors (MOSFET, IGBT)

● Reliability Testing: High/low temperature cycling, burn-in testing, and lifetime testing of semiconductor devices

● Optoelectronic Device Testing: Laser diode (LD), photodiode (PD), and LED wafer-level testing

● Compound Semiconductor Testing: GaAs, SiC, GaN wafer testing for RF and power devices

● R&D & Small-Batch Production: Prototyping and validation testing of new semiconductor designs

About Deaote

Suzhou Deaote Precision Mould Co., Ltd. is a leading high-tech enterprise specializing in R&D, manufacturing, and sales of precision moulds, high-precision motion components, and custom semiconductor testing equipment. With over 15 years of expertise in precision manufacturing, we serve global customers in the semiconductor, electronics, and industrial automation sectors.

Our 6 or 8 inches Wafer testing probe station leverages our core precision mould technology and motion control expertise to address the unique challenges of semiconductor wafer testing. We provide end-to-end solutions, from custom probe station design to on-site installation, calibration, and after-sales support, ensuring our products meet the highest standards of precision, reliability, and efficiency.

Committed to "Precision Drives Progress, Innovation Creates Value", Suzhou Deaote adheres to strict quality management systems (ISO 9001:2015 certified) and continuous R&D investment, delivering testing solutions that help our customers stay competitive in the rapidly evolving semiconductor industry.