Wafer Grooving

Built on Deaote's 15+ years of expertise in precision mould and motion component manufacturing, the Wafer Slotting Machine design optimizes structural rigidity while minimizing platform footprint, making it ideal for integration into compact wafer processing equipment. The platform features a granite base for thermal stability and anti-vibration performance, ensuring consistent grooving depth (±5μm tolerance) and slot width accuracy (±3μm) even during high-speed, continuous operation in cleanroom environments (Class 100/1000).

Compatible with diamond cutting tools, laser grooving heads, and plasma etching systems, the Wafer Slotting Machine supports diverse wafer grooving requirements—including dicing street grooving, edge trimming slots, and custom-shaped grooves for power semiconductor packaging. Its modular design allows for customization of travel ranges (X/Y: 100×100mm to 400×400mm) and motion parameters, enabling semiconductor manufacturers to achieve higher grooving yield, reduce tool wear, and meet the tight tolerance demands of advanced wafer processing.

Core Advantages

1. Ultra-High Precision for Wafer Grooving

Equipped with high-resolution linear encoders (0.05μm resolution) and direct-drive linear motors, the platform achieves ±0.5μm repeat positioning accuracy and ±1μm absolute positioning accuracy (X/Y axes). This ensures precise control of grooving path and depth, eliminating slot deviation, uneven depth, and edge chipping—critical for maintaining wafer structural integrity and subsequent die separation quality.

2. High-Rigidity Stacked Architecture

The Wafer Slotting Machine designs uses integrated magnesium alloy and aluminum alloy structural components with precision machining, delivering exceptional rigidity (≥200N/μm stiffness) to resist cutting force-induced deformation. This stability ensures consistent grooving quality across the entire wafer surface, even at high feed rates (up to 80mm/s) and heavy cutting loads (≤50N).

3. Low-Vibration & Thermally Stable Operation

Constructed with a natural granite base (thermal expansion coefficient ≤0.5×10⁻⁶/℃) and active vibration damping system, the Wafer Slotting Machine minimizes positional drift caused by temperature fluctuations (≤0.1μm/℃) and external vibrations. The non-contact direct-drive mechanism eliminates mechanical backlash and wear, ensuring long-term positioning stability (MTBF ≥30,000 hours) and reducing unplanned downtime for wafer processing lines.

4. Wide Wafer Compatibility & Flexibility

The Wafer Slotting Machine supports seamless switching between 4/6/8/12 inch wafer sizes with adjustable vacuum chucks and auto-centering mechanisms, no need for custom fixture replacement. It accommodates wafer thicknesses from 100μm to 800μm and is compatible with silicon, GaAs, SiC, and GaN wafers, adapting to grooving needs for logic chips, memory devices, and compound semiconductors.

5. High-Speed & Efficient Motion Control

Optimized motion control algorithms enable high-speed movement (X/Y max speed: 80mm/s) with ultra-low settling time (≤25ms for X/Y), supporting high-throughput wafer grooving (up to 150 wafers per hour for 8-inch wafers). The smooth acceleration/deceleration profile reduces tool impact force, extending diamond cutter lifespan by up to 30% compared to traditional belt-driven motion platforms.

6. Easy Integration & Cleanroom Compliance

Designed for Class 100 cleanroom operation, the platform features sealed linear motor enclosures and HEPA-filtered air circulation to prevent particle generation (≤0.1μm particle emission). Compatible with industry-standard communication protocols (EtherCAT, PROFINET, Modbus), it integrates seamlessly with wafer processing equipment control systems, reducing integration time and costs for equipment manufacturers.

Technical Specifications

Application Scenarios

Engineered for X-Y motion control in wafer grooving/sloting, our Wafer Slotting Machine is widely used in the following semiconductor applications:

● Wafer Dicing Street Grooving: Pre-grooving of dicing streets for subsequent laser or mechanical dicing of logic/memory chips

● Edge Trimming Slots: Precision slotting of wafer edges to remove defective material and improve packaging yield

● Power Semiconductor Grooving: Custom-shaped grooves for SiC/GaN power device packaging (heat dissipation channels)

● Wafer Level Packaging (WLP): Grooving for redistribution layer (RDL) isolation and die separation

● Compound Semiconductor Processing: Grooving of GaAs/GaN wafers for RF device fabrication

About Deaote

Our Wafer Slotting Machine leverages our core competencies in precision structural design and motion control engineering to address the unique challenges of wafer grooving. We provide end-to-end solutions—from custom platform design and prototyping to on-site installation, calibration, and lifetime technical support—ensuring our products meet the strictest industry standards for precision and reliability.

Committed to "Precision Drives Progress, Innovation Creates Value", Deaote is ISO 9001:2015 certified and invests 15% of annual revenue in R&D to develop next-generation motion solutions for the semiconductor industry. Our global service network ensures fast response times and local support for our international customers.